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Field Applications Manager (Flip Chip Bonding)

Ref: JN -102018-63440
Gehaltspaket
SGD8000.00 - SGD9500.00 per month
Ort
Asia, Singapore
Bereich
Engineering, Equipment
Datum
18 Oktober 2018
Vertragsform
Festanstellung

Cobalt is proud to partner with one of the world largest manufacturers and providers of semiconductor packaging, assembly equipment, and electronic assembly solutions. Due to business expanding in Singapore, they are looking to bring on board Field Applications Manager (Flip Chip Bonding).

In this role,

  • You will lead and manage the Field Application Engineering Team
  • Be a strong technical leader and take ownership of the technical mentoring of the team members
  • Serve as a key technical connection to the customers and be a technical advisor to both engineering and marketing with respect to customer technical requirements

To be successful in this role,

  • You will possess a Bachelor's Degree in Technical Engineering and have at least 10 years of Applications support experience (of which 3 years in managerial role) for a high tech semiconductor equipment supplier
  • Possess strong knowledge in semiconductor assembly processes, Eg. Flip Chip Bonding
  • Exposure experience in supporting customers in SEA, China and Korea

If an opportunity is of interest, then please share your CV with us at yfan@cobaltrecruitment.com or call us at +65 6800 9275 for a confidential discussion on this role.

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